3DiS Technologies SAS

Pdf

3DiS Technologies SAS

Location

  • 31676
  • Labège
  • France

Description of your activity

  • 3DiS Technologies offers 3D integration and 3D system packaging solutions based on its innovative 3D interconnection technologies. By leveraging the third dimension, 3DiS’s cutting-edge technologies enable miniaturization of electronic systems and passive devices while improving their performance.

Your ISD 2020 Objectives

Please describe your objectives for the ISD 2020 here

  • Commercial representation
  • Common research programs
  • Design
  • Licences / Technologies
  • Partnership for R&D Project
  • Production
  • Products
  • Research & Development
  • Services
  • Sub-contracting

What you Offer

Space and Ground Segment
  • RF Systems, Payloads and Technologies
  • Telecommunication systems/subsystems
  • RF technologies and equipment
  • EEE (electric, electromechanical & electronic) Components and quality
  • EEE component technologies
  • Space R&D
  • Specific Electronic Components
  • Support for partnerships research
  • Industrial Organization
  • Electromagnetic Technologies and Techniques
  • Wave Interaction and propagation
  • EMC/RFC/ESD

Your Needs

Space and Ground Segment
  • Institutional
  • Finance
  • RF Systems, Payloads and Technologies
  • Telecommunication systems/subsystems
  • EEE (electric, electromechanical & electronic) Components and quality
  • Methods and processes for product assurance of EEE components, including radiation hardness assurance
  • Mechanisms
  • MEMS technologies
  • Electromagnetic Technologies and Techniques
  • Antennas
  • Mission Operation and Ground Data systems
  • Advanced system concepts

References

  • CNES
  • Thales Alenia Space

Equipment, Technologies and Processes used

  • Clean room
  • Semiconductor
  • Thin-film deposition (PVD, CVD)
  • 3D Electroplating
  • Photolithography
  • Advanced 3D System Packaging